Anatomy of a High-Reliability Chip Resistor

To illustrate Mini-Systems approach, the following design and fabrication considerations are used in our thick film processes to maximize the components performance in:

Automated Electronic Assembly

Diamond saw die separation tightly controls the resistor's dimensional tolerances, thus improving pick and place assembly by reducing components misplacement and resets.

Surface Mount Adhesion

The unique, (5) sided construction of the wrap around termination maximizes component to board solder adhesion in a way that minimizes component tombstoning.

Electrical Performance

The fine nozzle, sand blasting method of abrasively trimming resistors results in a component that has lower noise, better short and long term stability and improved power handling characteristics than a LASER trimmed component.

Bondability

All resistors are fabricated with the resistor film sandwiched between a bottom conductor and a top conductor termination. This construction exposes the maximum bond pad area for multiple wire bonds, automated wire bonding and solder coverage. Also inherent to this design is better long term stability, and power handling.

Solderability

Hot solder dip tinning for optimum shelf life and best solder wetting.

Chip Attach

Precisely screened on backside conductors provides a uniform clear space and prevents shorting.

Reliability and Testing

Processed materials are continuously tested for mechanical and electrical performance parameters to Mil-PRF-55342. Our current DESC failure rating is "S", which represents more than (91) million hours of life testing without a failure.

Stray Capacitance

Minimized and consistent by controlled dimensions imparted by (5) precise screenings.