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Thick Film Division

Thick Film
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Thin Film Division

Thin Film
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Electronic Package Division

Electronic Package
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Thick & Thin Film - ISO 9001 Certified

 

 

Hybrid Assembly

PERFORMANCE SERVICES DEPENDABILITY
  • Technical sales, service, and engineering support
  • Design/Product Reviews
  • Research and Development
  • Application Engineering
  • Custom Layout and Design
  • Auto/Manual Gold Wirebonding
  • Specialized Substrate Metallization
  • Custom Packaging and Sub-Assemblies
  • Compliance to MIL-I-45208A
  • Certified Operators
  • High-Rel and Quality Standards
  • Outstanding Delivery Performance

Products:
Precision, Hi-Rel Ultra-Low TCR Chip Resistors.
Hybrid Microelectronics
Thick Film Technology
Surface Mount Technology
Chip and Wire Assemblies
Electronic Packaging
Contacts:

General Manager / Applications
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Quality Assurance:

Sales: 508-695-0203 Fax: 508-695-6076